High-Quality Lead-Free BGA Flux Paste – Recommended for Mobile Phone Repair & General Rework

SKU: Q-RAF-IN#4874

97 SAR inc. Vat.

Description

High-Quality Lead-Free BGA Flux Paste – Recommended for Mobile Phone Repair & General Rework

Description
This product is a lead-free, environmentally friendly flux paste designed to assist soldering in mobile phone repair and BGA rework. It improves solder wettability, enhances flow, and helps hold components in place during soldering. The paste is compatible with common PCB repair applications and is suitable for technicians working on fine-pitch components, BGA balls, and reballing processes.

Features

* Lead-free, environmentally friendly flux formulation

* Promotes better solder wetting and flow

* Helps secure components during soldering

* Suitable for BGA rework, mobile phone motherboard repair, and fine-pitch assembly

* Reduces oxidation and improves soldering quality

Specifications

Product name: BGA Flux Paste

Model: KNY-559

Brand: KANOYU

Net weight: 100 g

Type: Lead-free flux paste (non-metallic)

Color: Translucent

Application: Mobile phone repair, BGA rework, PCB soldering assistant

Usage Instructions

Use appropriate amount on soldering surface, heat with soldering iron or hot air to activate flux, then perform soldering. Clean after soldering if necessary.